Hermeticity Testing of MEMS and Microelectronic Packages
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Opis: Hermeticity Testing of MEMS and Microelectronic Packages - Marc P.Y. Desmulliez, Suzanne Costello

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today's package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types. It is suitable for MEMS and microelectronics engineers and researchers.Introduction to hermetic packages and leak types; Traditional hermeticity test techniques and standards; Limitations of existing hermeticity test methods in low volume packages; Novel methods of leak detection; Conclusions and vision.


Szczegóły: Hermeticity Testing of MEMS and Microelectronic Packages - Marc P.Y. Desmulliez, Suzanne Costello

Tytuł: Hermeticity Testing of MEMS and Microelectronic Packages
Autor: Marc P.Y. Desmulliez, Suzanne Costello
Producent: Artech House
ISBN: 9781608075270
Rok produkcji: 2013
Ilość stron: 200
Oprawa: Twarda
Waga: 0.44 kg


Recenzje: Hermeticity Testing of MEMS and Microelectronic Packages - Marc P.Y. Desmulliez, Suzanne Costello
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Hermeticity Testing of MEMS and Microelectronic Packages

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Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today's package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types. It is suitable for MEMS and microelectronics engineers and researchers.Introduction to hermetic packages and leak types; Traditional hermeticity test techniques and standards; Limitations of existing hermeticity test methods in low volume packages; Novel methods of leak detection; Conclusions and vision.

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Cena 552,00 PLN
Nasza cena 516,13 PLN
Oszczędzasz 6%
Wysyłka: Niedostępna
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Szczegóły: Hermeticity Testing of MEMS and Microelectronic Packages - Marc P.Y. Desmulliez, Suzanne Costello

Tytuł: Hermeticity Testing of MEMS and Microelectronic Packages
Autor: Marc P.Y. Desmulliez, Suzanne Costello
Producent: Artech House
ISBN: 9781608075270
Rok produkcji: 2013
Ilość stron: 200
Oprawa: Twarda
Waga: 0.44 kg


Recenzje: Hermeticity Testing of MEMS and Microelectronic Packages - Marc P.Y. Desmulliez, Suzanne Costello

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