Microwave and Millimeter-Wave Electronic Packaging

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Opis: Microwave and Millimeter-Wave Electronic Packaging - Rick Sturdivant

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. Without careful attention to these additional issues, it is not possible to successfully engineer electronic packaging at these frequencies. This resource presents the packaging issues which are unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques and how they can be tailored or analysed for higher frequency designs. The book's chapters are organised in logical groups and contain 30 different practical examples.Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer; Electromagnetic Modeling; Conclusions


Szczegóły: Microwave and Millimeter-Wave Electronic Packaging - Rick Sturdivant

Tytuł: Microwave and Millimeter-Wave Electronic Packaging
Autor: Rick Sturdivant
Producent: Artech House
ISBN: 9781608076970
Rok produkcji: 2014
Ilość stron: 261
Oprawa: Twarda
Waga: 0.57 kg


Recenzje: Microwave and Millimeter-Wave Electronic Packaging - Rick Sturdivant

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Microwave and Millimeter-Wave Electronic Packaging

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. Without careful attention to these additional issues, it is not possible to successfully engineer electronic packaging at these frequencies. This resource presents the packaging issues which are unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques and how they can be tailored or analysed for higher frequency designs. The book's chapters are organised in logical groups and contain 30 different practical examples.Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer; Electromagnetic Modeling; Conclusions

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Cena 533,00 PLN
Nasza cena 498,36 PLN
Oszczędzasz 6%
Wysyłka: Niedostępna
Dodaj do Schowka
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Szczegóły: Microwave and Millimeter-Wave Electronic Packaging - Rick Sturdivant

Tytuł: Microwave and Millimeter-Wave Electronic Packaging
Autor: Rick Sturdivant
Producent: Artech House
ISBN: 9781608076970
Rok produkcji: 2014
Ilość stron: 261
Oprawa: Twarda
Waga: 0.57 kg


Recenzje: Microwave and Millimeter-Wave Electronic Packaging - Rick Sturdivant

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