3D IC Integration and Packaging
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Opis: 3D IC Integration and Packaging - John Lau

A comprehensive guide to 3D IC integration and packaging methods and solutions, featuring detailed examples and real-world applications Semiconductor manufacturers are continuously seeking new paths to design and fabricate ICs with increased density, higher bandwidth, and lower power. Many design teams are now looking to 3D IC integration as an enabling technology for the development of the next generation of semiconductors. Based on a popular course developed by its author, 3D IC Integration and Packaging is written so that you can quickly acquire problem-solving skills and understand the trade-offs inherent in making system-level decisions. Provides cutting-edge, timely information on all aspects of 3D IC integration and packaging Advanced topics include TSV, thin-wafer handling, thermal management, and solder microbumping Practical applications of 3D IC technology are covered in full detail Author has written 16 engineering books and published more than 350 peer-reviewed papers


Szczegóły: 3D IC Integration and Packaging - John Lau

Tytuł: 3D IC Integration and Packaging
Autor: John Lau
Producent: McGraw-Hill
ISBN: 9780071848060
Rok produkcji: 2015
Ilość stron: 480
Oprawa: Twarda
Waga: 1.02 kg


Recenzje: 3D IC Integration and Packaging - John Lau
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3D IC Integration and Packaging

A comprehensive guide to 3D IC integration and packaging methods and solutions, featuring detailed examples and real-world applications Semiconductor manufacturers are continuously seeking new paths to design and fabricate ICs with increased density, higher bandwidth, and lower power. Many design teams are now looking to 3D IC integration as an enabling technology for the development of the next generation of semiconductors. Based on a popular course developed by its author, 3D IC Integration and Packaging is written so that you can quickly acquire problem-solving skills and understand the trade-offs inherent in making system-level decisions. Provides cutting-edge, timely information on all aspects of 3D IC integration and packaging Advanced topics include TSV, thin-wafer handling, thermal management, and solder microbumping Practical applications of 3D IC technology are covered in full detail Author has written 16 engineering books and published more than 350 peer-reviewed papers

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Cena 792,00 PLN
Nasza cena 740,51 PLN
Oszczędzasz 6%
Wysyłka: Niedostępna
Dodaj do Schowka
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Szczegóły: 3D IC Integration and Packaging - John Lau

Tytuł: 3D IC Integration and Packaging
Autor: John Lau
Producent: McGraw-Hill
ISBN: 9780071848060
Rok produkcji: 2015
Ilość stron: 480
Oprawa: Twarda
Waga: 1.02 kg


Recenzje: 3D IC Integration and Packaging - John Lau

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